US 12,232,287 B2
Electronic device including housing
Kidoc Son, Suwon-si (KR); Youngchun Kim, Suwon-si (KR); Byounggyu Park, Suwon-si (KR); Kyunghwan Song, Suwon-si (KR); and Hyuckki Lee, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Feb. 28, 2022, as Appl. No. 17/682,158.
Application 17/682,158 is a continuation of application No. PCT/KR2022/002108, filed on Feb. 11, 2022.
Claims priority of application No. 10-2021-0080906 (KR), filed on Jun. 22, 2021.
Prior Publication US 2022/0408582 A1, Dec. 22, 2022
Int. Cl. H05K 5/00 (2006.01); B23H 3/00 (2006.01); C25D 11/26 (2006.01); C25D 11/34 (2006.01); G06F 1/16 (2006.01); H05K 5/04 (2006.01)
CPC H05K 5/04 (2013.01) [B23H 3/00 (2013.01); C25D 11/26 (2013.01); C25D 11/34 (2013.01); G06F 1/1613 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing; and
at least one processor disposed inside the housing,
wherein the housing comprises:
a metal member comprising a metal including an electro chemical machined first convex and concave pattern formed into a surface of the metal member, and
an oxide inclusive coating layer exposed to an outside of the housing and disposed on a surface of the first convex and concave pattern of the metal with a shape corresponding to the shape of the first convex and concave pattern, and
wherein the first convex and concave pattern has at least a portion formed at a substantially uniform pitch and a substantially uniform height.