US 12,232,273 B2
Printed circuit board and method of fabricating the same
Yun Mi Bae, Seoul (KR); Soon Gyu Kwon, Seoul (KR); Sang Hwa Kim, Seoul (KR); Sang Young Lee, Seoul (KR); Jin Hak Lee, Seoul (KR); Han Su Lee, Seoul (KR); Dong Hun Jeong, Seoul (KR); In Ho Jeong, Seoul (KR); Dae Young Choi, Seoul (KR); and Jung Ho Hwang, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Filed by LG INNOTEK CO., LTD., Seoul (KR)
Filed on Jun. 20, 2023, as Appl. No. 18/337,706.
Application 18/337,706 is a continuation of application No. 17/653,054, filed on Mar. 1, 2022, granted, now 11,723,153.
Application 17/653,054 is a continuation of application No. 17/236,519, filed on Apr. 21, 2021, granted, now 11,297,720, issued on Apr. 5, 2022.
Application 17/236,519 is a continuation of application No. 17/005,522, filed on Aug. 28, 2020, granted, now 11,019,731, issued on May 25, 2021.
Application 17/005,522 is a continuation of application No. 16/717,679, filed on Dec. 17, 2019, granted, now 10,798,827, issued on Oct. 6, 2020.
Application 16/717,679 is a continuation of application No. 15/878,701, filed on Jan. 24, 2018, granted, now 10,531,569, issued on Jan. 7, 2020.
Application 15/878,701 is a continuation of application No. 15/594,778, filed on May 15, 2017, granted, now 9,913,383, issued on Mar. 6, 2018.
Application 15/594,778 is a continuation of application No. 14/831,674, filed on Aug. 20, 2015, granted, now 9,686,860, issued on Jun. 20, 2017.
Claims priority of application No. 10-2015-0100404 (KR), filed on Jul. 15, 2015.
Prior Publication US 2023/0337370 A1, Oct. 19, 2023
Int. Cl. H05K 1/02 (2006.01); C25D 3/48 (2006.01); C25D 5/02 (2006.01); C25D 5/48 (2006.01); C25D 7/12 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01); H05K 3/24 (2006.01); C25D 3/38 (2006.01)
CPC H05K 3/244 (2013.01) [C25D 3/48 (2013.01); C25D 5/022 (2013.01); C25D 5/48 (2013.01); C25D 7/123 (2013.01); H05K 1/0296 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); H05K 3/108 (2013.01); H05K 3/181 (2013.01); H05K 3/188 (2013.01); C25D 3/38 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/098 (2013.01); H05K 2201/0989 (2013.01); H05K 2201/099 (2013.01); H05K 2203/1184 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A circuit board comprising:
an insulating layer;
a first metal layer disposed on the insulating layer; and
a second metal layer disposed on the first metal layer such that the first metal layer is disposed between the second metal layer and the insulating layer,
wherein the first metal layer includes:
an upper surface in contact with the second metal layer;
a lower surface opposite from the upper surface and facing the insulating layer; and
a side surface disposed between the upper surface and the lower surface,
wherein at least a part of the side surface of the first metal layer overlaps the second metal layer in a vertical direction,
wherein the side surface of the first metal layer includes a curved portion,
wherein the first metal layer includes a first portion in which a width of the first metal layer gradually increases in the vertical direction from the upper surface of the first metal layer toward the lower surface of the first metal layer,
wherein the first portion of the first metal layer includes the curved portion of the side surface of the first metal layer, and
wherein the first metal layer includes:
a first region overlapped by the second metal layer in the vertical direction; and
a second region that is not overlapped by the second metal layer in the vertical direction.