US 12,232,271 B2
Component placement systems and methods of operating the same
Roy Brewel, Liempde (NL); Rudolphus Hendrikus Hoefs, Eindhoven (NL); and Wilhelmus Gijsbertus Leonardus Van Sprang, Eindhoven (NL)
Assigned to Kulicke and Soffa Industries, Inc., Fort Washington, PA (US)
Filed by Assembléon B.V., Eindhoven (NL)
Filed on Feb. 9, 2023, as Appl. No. 18/107,702.
Application 18/107,702 is a continuation of application No. 17/541,954, filed on Dec. 3, 2021, granted, now 11,612,089.
Prior Publication US 2023/0189493 A1, Jun. 15, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 13/04 (2006.01)
CPC H05K 13/04 (2013.01) 12 Claims
OG exemplary drawing
 
1. A component placement system comprising:
a first bond head array, including a first plurality of pick up tools, configured for simultaneously carrying a first plurality of electronic components, the first plurality of pick up tools being arranged in a linear configuration in the first bond head array;
a second bond head array, including a second plurality of pick up tools, configured for simultaneously carrying a second plurality of electronic components, the second plurality of pick up tools being arranged in a linear configuration in the second bond head array;
a first support structure for carrying each of the first bond head array and the second bond head array;
a second support structure for carrying the first bond head array independent of the second bond head array;
a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis by moving the first support structure along the first motion axis, the first motion system including a long stroke actuator;
a second motion system for carrying the first bond head array via the second support structure with respect to the first support structure along a second motion axis, the second motion system for moving the first bond head array along the second motion axis independent of the second bond head array, the second motion system including a long stroke actuator;
a third motion system for moving the second bond head array with respect to the first support structure along the second motion axis independent of the first bond head array, the third motion system including a long stroke actuator; and
a fourth motion system for carrying the first bond head array independent of the second bond head array along the first motion axis via the second support structure.