CPC H05K 1/185 (2013.01) [H01L 28/10 (2013.01); H05K 1/181 (2013.01); H01L 23/552 (2013.01); H01L 25/165 (2013.01); H05K 2201/1003 (2013.01)] | 20 Claims |
1. An electronic component module comprising:
a substrate having a first main surface and a second main surface, the second main surface being a mounting side;
a first electronic component mounted on the first main surface;
a conductive shield film covering the first electronic component and a side of the first main surface; and
an inductor element disposed inside the substrate, wherein:
the substrate includes a plurality of terminal conductors for connection arranged along an outer peripheral end of the second main surface;
the inductor element is disposed in a region surrounded by the plurality of terminal conductors when the substrate is viewed in a plan view;
the plurality of terminal conductors are outside an outer periphery of the inductor element when the substrate is viewed in the plan view; and
the inductor element is disposed between the first main surface and the second main surface in a thickness direction of the substrate.
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