US 12,232,269 B2
Electronic component module
Takahiro Kitazume, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Feb. 28, 2022, as Appl. No. 17/652,730.
Application 17/652,730 is a continuation of application No. PCT/JP2020/033360, filed on Sep. 3, 2020.
Claims priority of application No. 2019-163493 (JP), filed on Sep. 9, 2019.
Prior Publication US 2022/0192026 A1, Jun. 16, 2022
Int. Cl. H05K 1/18 (2006.01); H01L 23/552 (2006.01); H01L 25/16 (2023.01); H01L 49/02 (2006.01)
CPC H05K 1/185 (2013.01) [H01L 28/10 (2013.01); H05K 1/181 (2013.01); H01L 23/552 (2013.01); H01L 25/165 (2013.01); H05K 2201/1003 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic component module comprising:
a substrate having a first main surface and a second main surface, the second main surface being a mounting side;
a first electronic component mounted on the first main surface;
a conductive shield film covering the first electronic component and a side of the first main surface; and
an inductor element disposed inside the substrate, wherein:
the substrate includes a plurality of terminal conductors for connection arranged along an outer peripheral end of the second main surface;
the inductor element is disposed in a region surrounded by the plurality of terminal conductors when the substrate is viewed in a plan view;
the plurality of terminal conductors are outside an outer periphery of the inductor element when the substrate is viewed in the plan view; and
the inductor element is disposed between the first main surface and the second main surface in a thickness direction of the substrate.