US 12,232,268 B2
Wiring substrate and method for manufacturing wiring substrate
Hirotaka Taniguchi, Ogaki (JP); and Akihide Ishihara, Ogaki (JP)
Assigned to IBIDEN CO., LTD., Ogaki (JP)
Filed by IBIDEN CO., LTD., Gifu (JP)
Filed on Feb. 25, 2022, as Appl. No. 17/680,369.
Claims priority of application No. 2021-067403 (JP), filed on Apr. 12, 2021.
Prior Publication US 2022/0330432 A1, Oct. 13, 2022
Int. Cl. H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/183 (2013.01) [H05K 1/113 (2013.01); H05K 3/0044 (2013.01); H05K 3/4697 (2013.01); H05K 3/4661 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/09472 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/308 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A wiring substrate, comprising:
an insulating layer;
a build-up part formed on the insulating layer and comprising an interlayer insulating layer and a conductor layer; and
a conductor layer formed on the insulating layer and comprising an electronic component mounting pad configured to mount an electronic component,
wherein the build-up part has a cavity penetrating through the build-up part such that the cavity is configured to accommodate the electronic component and has an inner wall and a bottom surface having a groove and that the groove is extending entirely in an outer edge part of the bottom surface and formed continuous with the inner wall surface of the cavity, and the conductor layer formed on the insulating layer is formed such that the electronic component mounting pad is formed on an entire portion of the bottom surface inside the groove and that the cavity is exposing the electronic component mounting pad of the conductor layer formed on the insulating layer.