US 12,232,267 B2
Electronics assembly
Vinski Bräysy, Oulunsalo (FI); Ilpo Hänninen, Oulunsalo (FI); Pälvi Apilo, Oulunsalo (FI); Mikko Heikkinen, Oulunsalo (FI); Topi Wuori, Oulunsalo (FI); Mikko Sippari, Oulunsalo (FI); and Heikki Alamäki, Oulunsalo (FI)
Assigned to TACTOTEK OY, Oulunsalo (FI)
Filed by TactoTek Oy, Oulunsalo (FI)
Filed on Mar. 19, 2024, as Appl. No. 18/609,232.
Application 18/609,232 is a continuation of application No. 18/353,143, filed on Jul. 17, 2023, granted, now 11,950,367.
Application 18/353,143 is a continuation of application No. 17/704,264, filed on Mar. 25, 2022, granted, now 11,910,530, issued on Feb. 20, 2024.
Prior Publication US 2024/0237218 A1, Jul. 11, 2024
Int. Cl. H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/12 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01)
CPC H05K 1/181 (2013.01) [H05K 1/111 (2013.01); H05K 1/144 (2013.01); H05K 3/12 (2013.01); H05K 3/305 (2013.01); H05K 3/321 (2013.01); H05K 2201/0129 (2013.01)] 2 Claims
OG exemplary drawing
 
1. An electronics assembly, comprising:
a second substrate, said second substrate being a formable film or sheet, preferably of plastic material, comprising a second connection portion connected to a second circuitry printed on a surface of the second substrate,
an electronics module attached to the second substrate, wherein the electronics module comprises:
a first circuitry on a first surface at a first side of a circuit board,
at least one electronics component on the circuit board and in electrical connection with the first circuitry, wherein a conformal coating embeds the at least one electronics component on the first surface, and
at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is at least one of electrically connected to or is comprised in the first circuitry;
wherein a second surface of the circuit board, being on the opposite second side than the first surface, faces the second substrate;
electrically conductive joint material, being one selected from the group consisting of solder material, conductive adhesive, conductive ink, conductive tape, arranged onto the first and the second connection portions to extend between the first and the second connection portions to electrically connect the electronics module to the second circuitry via the electrically conductive joint material;
a molded material layer embedding the electronics module; and
a third substrate on the opposite side of the electronics module relative to the second substrate, wherein the electronics module is attached to the third substrate by a third, electronically non-conductive, adhesive.