US 12,232,266 B2
Connection method for chip and circuit board, and circuit board assembly and electronic device
Yu-chong Tai, Changsha (CN); Changlin Pang, Changsha (CN); and Xihua Xia, Changsha (CN)
Assigned to INTELLIMICRO MEDICAL CO., LTD., Changsha (CN)
Filed by INTELLIMICRO MEDICAL CO., LTD., Changsha (CN)
Filed on Nov. 16, 2022, as Appl. No. 18/055,946.
Application 18/055,946 is a continuation of application No. PCT/CN2021/079517, filed on Mar. 8, 2021.
Claims priority of application No. 202010420625.9 (CN), filed on May 18, 2020.
Prior Publication US 2023/0081618 A1, Mar. 16, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/08 (2006.01); H05K 3/10 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01); H05K 3/42 (2006.01)
CPC H05K 1/181 (2013.01) [H05K 1/0266 (2013.01); H05K 3/0008 (2013.01); H05K 3/108 (2013.01); H05K 3/305 (2013.01); H05K 3/321 (2013.01); H05K 3/428 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10628 (2013.01); H05K 2203/0455 (2013.01); H05K 2203/0557 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/143 (2013.01); H05K 2203/1438 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A connection method for a chip and a circuit board, comprising:
placing the chip into an accommodating slot of an operating station, the accommodating slot being connected with a vacuum tube to fix the chip;
placing the circuit board on the fixed chip, the circuit board having a first surface in contact with the chip, the chip having a plurality of contacts, the plurality of contacts being arranged in rows and columns to form as an array, and the circuit board having a plurality of through holes aligned with the plurality of contacts respectively;
placing a mask on a second surface of the circuit board, the mask having a plurality of openings aligned with the plurality of through holes respectively;
covering a surface of the mask with a conductive adhesive to fill the plurality of through holes with the conductive adhesive; and
keeping portions of the conductive adhesive that are respectively in the plurality of through holes to be spaced apart from each other, wherein the portions of the conductive adhesive that fill the plurality of through holes remain so as to provide an electrical connection between the circuit board and the chip.