US 12,232,263 B2
Component carriers connected by staggered interconnect elements
Abderrazzaq Ifis, Leoben (AT); Jens Riedler, Trofaiach (AT); and Christopher Hermann, Velden am Wörthersee (AT)
Assigned to AT&SAustria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed by AT&S Austria Technologie & Systemtechnik AG, Leoben (AT)
Filed on May 23, 2024, as Appl. No. 18/673,206.
Application 18/673,206 is a continuation of application No. 17/650,361, filed on Feb. 8, 2022, granted, now 12,052,824.
Claims priority of application No. 21156051 (EP), filed on Feb. 9, 2021.
Prior Publication US 2024/0314931 A1, Sep. 19, 2024
Int. Cl. H05K 1/14 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/144 (2013.01) [H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 3/4623 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a first component carrier comprising a first stack which comprises at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure;
a second component carrier comprising a second stack which comprises at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure; and
an intermediate structure comprising at least one electrically conductive vertical interconnect element in an at least partially dielectric sheet and being directly connected between the first component carrier and the second component carrier for electrically coupling the first component carrier with the second component carrier, said at least partially dielectric sheet of the intermediate structure comprising a central stiffener through which said at least one electrically conductive vertical interconnect element extends, and said at least one electrically conductive vertical interconnect element comprising a metal paste.