US 12,232,261 B2
Printed wiring board
Kou Noguchi, Koka (JP); and Masaki Miyabara, Koka (JP)
Assigned to SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Koka (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 18/007,590
Filed by SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Koka (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed Mar. 29, 2021, PCT No. PCT/JP2021/013296
§ 371(c)(1), (2) Date Dec. 1, 2022,
PCT Pub. No. WO2021/246033, PCT Pub. Date Dec. 9, 2021.
Claims priority of application No. 2020-097435 (JP), filed on Jun. 4, 2020.
Prior Publication US 2023/0199960 A1, Jun. 22, 2023
Int. Cl. H05K 1/11 (2006.01)
CPC H05K 1/116 (2013.01) [H05K 2201/10287 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A printed wiring board comprising:
a board having a through-hole;
a land portion that is disposed on an inner circumferential surface of the through-hole and on a surface of the board at a circumferential edge of the through-hole, and that has a through-hole conductor portion; and
a wire that is disposed on the surface of the board and that has one longitudinal end portion electrically connected to the land portion,
a maximum length of a connection portion between the wire and the land portion being greater than or equal to a sum of a maximum diameter of the through-hole and a minimum line width of the wire.