a Printed Circuit Board (PCB) comprising a first face facing a first direction and a second face facing a second direction opposite to the first direction;

a semiconductor chip mounted on the second face;

at least one conductive pad disposed on the second face;

a solder resist layer disposed on the second face and including at least one opening for exposing the at least one conductive pad, wherein the at least one opening having an inner diameter and an outer diameter, disposed along an outer periphery of the at least one conductive pad; and

at least one external terminal disposed on the semiconductor chip and bonded to the at least one conductive pad,

wherein the at least one conductive pad comprises:

a first region having a smaller diameter than the outer diameter; and

at least one second region extending from the first region in a first outer circumferential direction, and located at least in part between both ends of the at least one opening,

wherein at least part of the second region is overlapped with at least part of the solder resist layer, and

wherein one side portion of the at least one external terminal is pushed by the at least part of the solder resist layer.