US 12,232,258 B2
Electronic device
Shang-Ru Wu, Miao-Li County (TW); Hua-Pin Chen, Miao-Li County (TW); Shuai Wang, Miao-Li County (TW); and Chien-Hao Kuo, Miao-Li County (TW)
Assigned to INNOLUX CORPORATION, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Oct. 6, 2022, as Appl. No. 17/938,403.
Claims priority of provisional application 63/278,509, filed on Nov. 12, 2021.
Claims priority of application No. 202211026803.5 (CN), filed on Aug. 25, 2022.
Prior Publication US 2023/0156916 A1, May 18, 2023
Int. Cl. H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/111 (2013.01) [H05K 1/117 (2013.01); H05K 1/181 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/09418 (2013.01); H05K 2201/09427 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10287 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate, comprising a bonding area;
a plurality of first bonding pads, disposed on the substrate, and disposed in the bonding area; and
a plurality of first dummy pads, disposed on the substrate, and disposed in the bonding area,
wherein a part of the plurality of first bonding pads are arranged along a first direction, and another part of the plurality of first bonding pads are arranged along a second direction, and
wherein there is an included angle between the first direction and the second direction, and the included angle is greater than 0 degrees and less than 90 degrees,
wherein the substrate further comprises a working area, and the plurality of first dummy pads are disposed between the working area and the another part of the plurality of first bonding pads.