US 12,232,255 B2
Circuit board
Yong Suk Kim, Seoul (KR); and Jeong Han Kim, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Appl. No. 18/011,293
Filed by LG INNOTEK CO., LTD., Seoul (KR)
PCT Filed Jun. 17, 2021, PCT No. PCT/KR2021/007600
§ 371(c)(1), (2) Date Dec. 19, 2022,
PCT Pub. No. WO2021/256869, PCT Pub. Date Dec. 23, 2021.
Claims priority of application No. 10-2020-0073583 (KR), filed on Jun. 17, 2020.
Prior Publication US 2023/0269872 A1, Aug. 24, 2023
Int. Cl. H05K 1/00 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/0306 (2013.01) [H05K 1/056 (2013.01); H05K 1/115 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A circuit board comprising:
an insulating portion including a plurality of insulating layers;
a circuit pattern disposed on a surface of at least one insulating layer among the plurality of insulating layers; and
a via passing through at least one insulating layer among the plurality of insulating layers;
wherein the insulating portion includes:
a first insulating portion including at least one insulating layer, including a first insulating material; and
a second insulating portion disposed on the first insulating portion,
wherein the second insulating portion includes:
a first layer disposed on the first insulating portion and including a second insulating material different from the first insulating materials; and
a second layer disposed on the first layer and including a third insulating material different from the first and second insulating materials,
wherein the circuit pattern includes a first circuit pattern disposed on the second layer of the second insulating portion;
wherein the via includes a first via passing through the second layer of the second insulating portion and electrically connected to the first circuit pattern; and
wherein the second layer of the second insulating portion is a solder resist.