US 12,232,250 B2
Stiffener ring and surface packaging assembly
Chuncheng Gong, Shenzhen (CN); Li Fan, Dongguan (CN); Weijin Pan, Dongguan (CN); Junwei Mu, Dongguan (CN); and Ge Zhang, Dongguan (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Guangdong (CN)
Filed on Oct. 27, 2022, as Appl. No. 17/974,619.
Application 17/974,619 is a continuation of application No. PCT/CN2021/090585, filed on Apr. 28, 2021.
Claims priority of application No. 202010348428.0 (CN), filed on Apr. 28, 2020; and application No. 202110439387.0 (CN), filed on Apr. 23, 2021.
Prior Publication US 2023/0066053 A1, Mar. 2, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 23/32 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0271 (2013.01) [H01L 23/32 (2013.01); H01L 23/562 (2013.01); H05K 1/181 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/10424 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A stiffener ring, configured to reduce warpage of a substrate of a surface packaging assembly, wherein the stiffener ring comprises a stiffener ring body that is annular and at least one adjustment block that is disposed at a same layer as the stiffener ring body and that is fastened to at least one corner of the stiffener ring body; and
a coefficient of thermal expansion of the at least one adjustment block is less than a coefficient of thermal expansion of the stiffener ring body;
wherein the stiffener ring body comprises two material layers, and a lamination direction of the two material layers is perpendicular to a surface that is of the stiffener ring and that is configured for being attached to the substrate; and
a warpage direction of thermal expansion of the stiffener ring body is opposite to a warpage direction of thermal expansion of the substrate.