| CPC H05K 1/0219 (2013.01) [H05K 1/115 (2013.01); H05K 1/185 (2013.01); H05K 2201/09636 (2013.01)] | 8 Claims |
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1. A circuit module comprising:
a multilayer board having a plurality of first through-holes each penetrating at least one layer thereof;
a plurality of high frequency components disposed in the plurality of first through-holes, respectively; and
a plurality of shield parts individually surrounding the plurality of high frequency components, wherein
the multilayer board including a plurality of second through-holes, each penetrating at least a layer in which each high frequency component is disposed and each provided around each high frequency component, and the multilayer board having a wiring being a conductor and connected to a terminal of the high frequency component in a disposition layer in which the high frequency component is disposed,
an interval between a pair of the plurality of second through-holes adjacent to each other with the wiring therebetween is greater than an interval between another pair of the plurality of second through-holes adjacent to each other,
each of the plurality of shield parts includes a first conductor, a second conductor, and a plurality of third conductors,
the first conductor and the second conductor sandwich the high frequency component in a lamination direction of the multilayer board, and
the plurality of third conductors are i-s-disposed in the plurality of second through-holes, respectively.
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