US 12,231,870 B2
Enhanced headphone design using DSP and array technology
Ulrich Horbach, Oberschneiding (DE)
Assigned to Harman International Industries, Incorporated, Stamford, CT (US)
Filed by Harman International Industries, Incorporated, Stamford, CT (US)
Filed on Dec. 23, 2022, as Appl. No. 18/088,037.
Claims priority of application No. 22150220 (EP), filed on Jan. 4, 2022.
Prior Publication US 2023/0217206 A1, Jul. 6, 2023
Int. Cl. H04S 7/00 (2006.01)
CPC H04S 7/304 (2013.01) [H04S 2420/01 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A headphone arrangement comprising:
two earphones, wherein each earphone from among the two earphones comprises a housing that encompasses a low-frequency transducer and an array of at least three high-frequency transducers, wherein:
the low-frequency transducer of each earphone is disposed on or over an ear canal of a user when the earphone is worn by the user, and wherein the low-frequency transducer of each earphone is configured to broadcast low-frequency sound that corresponds to low-frequency components of an input signal; and
the array of at least three high frequency transducers of each earphone is configured to broadcast high-frequency sound that corresponds to high-frequency components of the input signal, and the array of at least three high frequency transducers of each earphone is disposed adjacent to the low-frequency transducer and in a lower rostral quadrant of a full circle around the low-frequency transducer when the earphone is worn by the user.