US 12,231,852 B2
Low-latency communication protocol for binaural applications
Ivo Leonardus Coenen, Coffrane (CH); and Dennis Wayne Mitchler, Gloucester (CA)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed on Dec. 20, 2023, as Appl. No. 18/391,468.
Application 18/391,468 is a division of application No. 17/931,747, filed on Sep. 13, 2022, granted, now 11,882,406.
Application 17/931,747 is a division of application No. 17/143,324, filed on Jan. 7, 2021, granted, now 11,503,416, issued on Nov. 15, 2022.
Prior Publication US 2024/0129676 A1, Apr. 18, 2024
Int. Cl. H04R 25/00 (2006.01); H04B 5/70 (2024.01)
CPC H04R 25/554 (2013.01) [H04B 5/70 (2024.01); H04R 25/407 (2013.01); H04R 25/552 (2013.01); H04R 25/604 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A hearing instrument system, comprising:
a hearing instrument including:
a microphone;
a transceiver configured for wireless communication; and
a processor configured to execute software instructions stored in a memory, the software instructions, when executed, configuring the processor to:
transmit protocol packets at regular intervals, each of the protocol packets configured to add a latency; and
transmit audio samples of audio collected at the microphone in data packets, the data packets being transmitted between protocol packets and having a number of bits smaller than a number of bits of the protocol packets so that the latency added by each of the protocol packets is compensated for by the data packets transmitted between the protocol packets.