| CPC H04B 1/40 (2013.01) [H03F 3/245 (2013.01); H03F 2200/171 (2013.01); H03F 2200/222 (2013.01); H03F 2200/294 (2013.01); H03F 2200/451 (2013.01)] | 17 Claims |

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1. A radio-frequency module comprising:
a mounting substrate including a ground electrode layer formed by a planar wiring pattern;
a plurality of external connection terminals set to ground potential and arranged on a first main surface of the mounting substrate;
a first radio-frequency component that includes a reception filter and a low noise amplifier and is mounted on the first main surface, wherein the plurality of external connection terminals are connected to the ground electrode layer and are arranged at an outer periphery of the first main surface with respect to the first radio-frequency component;
a second radio-frequency component that includes a transmission filter and is mounted on a second main surface opposite to the first main surface of the mounting substrate; and
a first matching element that is mounted on the first main surface and performs impedance matching between the low noise amplifier and the reception filter; wherein
in a plan view of the mounting substrate, at least part of a footprint of the first radio-frequency component overlaps the ground electrode layer, and
in a plan view of the mounting substrate, a footprint of the first matching element does not overlap the ground electrode layer.
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