US 12,231,110 B2
Electronic component and method of manufacturing electronic component
Kazunori Inoue, Nagaokakyo (JP); Shintaro Otsuka, Nagaokakyo (JP); Koichiro Kawasaki, Nagaokakyo (JP); Hidefumi Nakanishi, Nagaokakyo (JP); Masakazu Atarashi, Nagaokakyo (JP); Masahiro Fukushima, Nagaokakyo (JP); and Yasuyuki Toyota, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on May 16, 2022, as Appl. No. 17/745,443.
Application 17/745,443 is a continuation of application No. PCT/JP2020/041645, filed on Nov. 9, 2020.
Claims priority of application No. 2019-207808 (JP), filed on Nov. 18, 2019.
Prior Publication US 2022/0278668 A1, Sep. 1, 2022
Int. Cl. H03H 9/10 (2006.01); H03H 3/08 (2006.01); H03H 9/145 (2006.01)
CPC H03H 9/1092 (2013.01) [H03H 3/08 (2013.01); H03H 9/145 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
a substrate;
a functional element on the substrate;
a first electrode on the substrate and electrically connected to the functional element;
a support body made of an insulator and protruding from the substrate and covering the first electrode;
a cover portion opposing the substrate and supported by the support body;
a second electrode in a via hole extending through the support body and the cover portion and electrically connected to the first electrode; and
a projection on the first electrode in the via hole; wherein
a hollow space is defined by the substrate, the support body, and the cover portion;
the functional element is located in the hollow space; and
the projection is made of an insulator and is completely covered by the second electrode.