US 12,231,055 B2
Semiconductor module and power converter
Tetsuro Fujiwara, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Jan. 10, 2023, as Appl. No. 18/095,213.
Claims priority of application No. 2022-020937 (JP), filed on Feb. 15, 2022.
Prior Publication US 2023/0261585 A1, Aug. 17, 2023
Int. Cl. H02M 7/53 (2006.01); H02M 7/00 (2006.01); H02M 7/5387 (2007.01)
CPC H02M 7/003 (2013.01) [H02M 7/5387 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor module comprising:
a switching circuit composed of a first semiconductor element and a second semiconductor element connected in series;
a first busbar connected to a positive electrode side of the first semiconductor element;
a second busbar connected to a negative electrode side of the second semiconductor element; and
a third busbar connected to a negative electrode side of the first semiconductor element and a positive electrode side of the second semiconductor element, wherein
the first busbar, the second busbar, and the third busbar extend in a same direction, and
one busbar out of the first busbar and the second busbar is disposed such that the third busbar and another busbar out of the first busbar and the second busbar are interposed within the one busbar.