CPC H01S 5/02212 (2013.01) [H01S 5/02345 (2021.01); H01S 5/02415 (2013.01); H01S 5/02476 (2013.01); H01L 2924/12042 (2013.01)] | 16 Claims |
1. A header for an electronic component, comprising:
a base having a first electrical feedthrough and a second electrical feedthrough;
a first feedthrough pin in the first electrical feedthrough;
a second feedthrough pin in the second electrical feedthrough, wherein the first and second feedthrough pins extend through the base and are electrically isolated to the base within the first and second electrical feedthroughs, respectively;
a pedestal connected to the base; and
two submounts each comprising a carrier with a structured conductor plating, the structured conductor plating comprising at least two conductor traces, with one of the at least two conductor traces of each of the two submounts being electrically connected to one of the first and second feedthrough pins,
wherein the two submounts have an identical structure but are mounted onto the pedestal so that a first submount is flipped with respect to a second submount,
wherein the structured conductor plating has a pattern that is a mirror symmetrical with respect to a symmetry plane, and
wherein the symmetry plane is located between two opposite ends of each of the two submounts.
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