US 12,230,902 B2
Data communication system
Eric Zbinden, Santa Clara, CA (US); and Jignesh H. Shah, New Albany, IN (US)
Assigned to SAMTEC, INC., New Albany, IN (US)
Filed by SAMTEC, INC., New Albany, IN (US)
Filed on Sep. 28, 2022, as Appl. No. 17/936,013.
Application 17/936,013 is a continuation of application No. 16/764,142, granted, now 11,495,899, previously published as PCT/US2018/060923, filed on Nov. 14, 2018.
Claims priority of provisional application 62/704,025, filed on Oct. 9, 2018.
Claims priority of provisional application 62/727,227, filed on Sep. 5, 2018.
Claims priority of provisional application 62/726,833, filed on Sep. 4, 2018.
Claims priority of provisional application 62/614,626, filed on Jan. 8, 2018.
Claims priority of provisional application 62/586,135, filed on Nov. 14, 2017.
Prior Publication US 2023/0014513 A1, Jan. 19, 2023
Int. Cl. H01R 12/71 (2011.01); H01R 12/72 (2011.01); H01R 13/187 (2006.01)
CPC H01R 12/714 (2013.01) [H01R 12/724 (2013.01); H01R 13/187 (2013.01)] 40 Claims
OG exemplary drawing
 
1. An electrical connector comprising:
an electrically insulative connector housing;
at least one electrical signal contact supported by the connector housing, wherein the electrical signal contact defines a mating end, and a mounting end configured to be compressed against an electrical contact member of a printed circuit board so as to mount the electrical connector to the printed circuit board; and
an electrical cable that extends into the connector housing and is mating to the mating end of the electrical signal contact, such that the electrical cable extends away from the printed circuit board,
wherein at least a portion of the electrical connector is configured to fit in a gap that is up to substantially 5 mm as defined along a select direction from the printed circuit board to an overhang of a heat sink that is disposed on an integrated circuit, such that the electrical connector is spaced from the heat sink along the select direction when the electrical connector is mounted to the printed circuit board and the heat sink is disposed on the integrated circuit.