US 12,230,879 B2
System and method for ground fencing
Xiaofang Mu, San Jose, CA (US); Chi V Pham, San Jose, CA (US); Mingjuan Zhu, Saratoga, CA (US); Bo Tong Deng, Santa Cruz, CA (US); Bo Zhang, San Jose, CA (US); Srinivasa Yasasvy Sateesh Bhamidipati, Milpitas, CA (US); Vineet Nayak, Sunnyvale, CA (US); and Daniel C Kong, Mountain View, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on May 6, 2022, as Appl. No. 17/738,787.
Prior Publication US 2023/0361460 A1, Nov. 9, 2023
Int. Cl. H05K 1/02 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01Q 1/22 (2006.01); H01Q 1/48 (2006.01); H01Q 1/52 (2006.01)
CPC H01Q 1/526 (2013.01) [H01L 23/49827 (2013.01); H01L 23/552 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/48 (2013.01); H05K 1/0222 (2013.01); H01L 2223/6677 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a logic board comprising a signal via; and
an interposer coupled to the logic board, the interposer comprising:
a discontinuous inner plating fence comprising a first cut-out portion; and
a discontinuous outer plating fence at least partially surrounding the discontinuous inner plating fence, the discontinuous outer plating fence comprising a second cut-out portion, and the first cut-out portion being offset from the second cut-out portion.