	US 12,230,874 B2
	Substrate-integrated circularly polarized electromagnetic radiation structure and array
Lidong Chi, Guangdong (CN); Alex Qi, Waterloo (CA); Yunlong Luo, Guangdong (CN); Ge Shi, Guangdong (CN); Yihong Qi, Guangdong (CN); Ruini Xue, Guangdong (CN); Ronghao Jin, Guangdong (CN); and Zhanghua Cai, Guangdong (CN)
Assigned to PONTOSENSE INC., Waterloo (CA)
Appl. No. 18/251,380
Filed by PONTOSENSE INC., Waterloo (CA)
PCT Filed Nov. 3, 2021, PCT No. PCT/CN2021/128299 § 371(c)(1), (2) Date May 1, 2023, PCT Pub. No. WO2022/095866, PCT Pub. Date May 12, 2022.
Claims priority of application No. 202011215729.2 (CN), filed on Nov. 4, 2020.
Prior Publication US 2023/0411839 A1, Dec. 21, 2023
Int. Cl. H01Q 1/38 (2006.01); H01Q 1/50 (2006.01); H01Q 21/06 (2006.01); H01Q 21/24 (2006.01)

CPC H01Q 1/38 (2013.01) [H01Q 1/50 (2013.01); H01Q 21/065 (2013.01); H01Q 21/24 (2013.01)]

9 Claims

1. A substrate-integrated circularly polarized electromagnetic radiation structure, wherein comprising an upper metal radiation structure, a lower metal backplane and a feeder; a plurality of connection points are provided between the upper metal radiation structure and the lower metal backplane;

the upper metal radiation structure comprises a metal ring, and two metal branches disposed within the metal ring; the metal branches are bent structures; the two metal branches are arranged symmetrically relative to a feeder center; and the metal ring is a rectangular ring structure;

wherein an intermediate dielectric substrate is provided between the upper metal radiation structure and the lower metal backplane; and a via hole is provided on the intermediate layer substrate at a position corresponding to a connection point between the upper metal radiation structure and the lower metal backplane.