US 12,230,865 B2
Polymer composition for use in an antenna system
Young Shin Kim, Cincinnati, OH (US)
Assigned to Ticona LLC, Florence, KY (US)
Filed by Ticona LLC, Florence, KY (US)
Filed on Jun. 27, 2023, as Appl. No. 18/341,801.
Application 18/341,801 is a continuation of application No. 17/178,318, filed on Feb. 18, 2021, granted, now 11,728,559.
Prior Publication US 2023/0352812 A1, Nov. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. C08K 3/00 (2018.01); C08K 3/04 (2006.01); C08K 3/30 (2006.01); C08K 7/06 (2006.01); C08K 7/14 (2006.01); C08L 67/04 (2006.01); H01Q 1/24 (2006.01); H01Q 21/06 (2006.01)
CPC H01Q 1/241 (2013.01) [C08K 3/04 (2013.01); C08K 3/30 (2013.01); C08K 7/06 (2013.01); C08K 7/14 (2013.01); C08L 67/04 (2013.01); H01Q 21/065 (2013.01); C08K 2003/3045 (2013.01)] 34 Claims
OG exemplary drawing
 
1. A molded part comprising a polymer composition comprising a semiconductive material distributed within a polymer matrix, wherein the semiconductive material includes inorganic particles and an electrically conductive material, the inorganic particles having an average particle size of from about 0.1 to about 100 μm and an electrical conductivity about 500 μS/cm or less, wherein the polymer matrix contains at least one liquid crystalline polymer, and further wherein the polymer composition exhibits a dielectric constant of about 4 or more and a dissipation factor of about 0.3 or less, as determined at a frequency of 2 GHz, wherein one or more conductive elements are formed on a surface of the part.