| CPC H01P 5/10 (2013.01) [H01F 27/2804 (2013.01); H01Q 9/16 (2013.01)] | 11 Claims |

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1. Balun comprising first and second stacked conductive tracks, located at a distance and opposite to each other, and having a same pattern;
further comprising first and second microstrip lines each comprising a strip respectively located vertically in line with and at a distance from the first and second conductive tracks, the first and second conductive tracks being interposed between the strips; and
wherein a second conductive via connects an end of the strip of the first microstrip line to an end of the strip of the second microstrip line.
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