US 12,230,855 B2
Waveguide structure and method for manufacturing waveguide structure
Hideki Yasuda, Kanagawa (JP); Ichihiko Hashimoto, Kanagawa (JP); Kazuhiro Yokoi, Santa Clara, CA (US); Yohei Takahashi, Santa Clara, CA (US); and Koki Takahashi, Kanagawa (JP)
Assigned to FUJIFILM CORPORATION, Tokyo (JP)
Filed by FUJIFILM CORPORATION, Tokyo (JP)
Filed on May 31, 2022, as Appl. No. 17/804,602.
Application 17/804,602 is a continuation of application No. PCT/JP2020/038187, filed on Oct. 8, 2020.
Claims priority of provisional application 62/952,481, filed on Dec. 23, 2019.
Prior Publication US 2022/0367999 A1, Nov. 17, 2022
Int. Cl. H01P 1/22 (2006.01); H01P 3/08 (2006.01); H01P 7/08 (2006.01); H01P 11/00 (2006.01); H05K 9/00 (2006.01)
CPC H01P 3/081 (2013.01) [H01P 1/227 (2013.01); H01P 7/08 (2013.01); H01P 11/001 (2013.01); H05K 9/0081 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A waveguide structure comprising:
at least one transmission line; and
at least one conductive pattern layer,
wherein at least a portion of the transmission line and at least a portion of the conductive pattern layer overlap each other as observed from a surface side of the conductive pattern layer,
a surface electrical resistance value of the conductive pattern layer is in a range of 0.005Ω/□ to 30Ω/□, and
at least a portion of the conductive pattern layer and at least a portion of the transmission line come into contact with each other.