| CPC H01L 33/54 (2013.01) [H01L 21/561 (2013.01); H01L 21/6835 (2013.01); H01L 23/3185 (2013.01); H01L 24/97 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 33/20 (2013.01); H01L 33/32 (2013.01); H01L 33/60 (2013.01); H01L 2221/68354 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/95101 (2013.01); H01L 2224/95136 (2013.01); H01L 2224/95143 (2013.01); H01L 2924/10156 (2013.01); H01L 2924/10157 (2013.01); H01L 2924/15156 (2013.01); H01L 2924/15157 (2013.01); H01L 2933/005 (2013.01)] | 11 Claims |

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1. An encapsulated emissive element for selective fluidic assembly comprising:
a micro-light emitting diode (micro-LED) having a closed perimeter shape, as viewed from a horizontal plane top-down perspective, comprising a top surface, a bottom surface with a first length in the horizontal plane, sidewall surfaces with a first thickness between the micro-LED top and bottom surfaces less than the first length, and a pair of electrical contacts; and,
a fluidic assembly key without electrical contacts, exposing the micro-LED electrical contacts and a second length of micro-LED bottom surface, where the second length is greater than the first thickness, while at least partially encapsulating the micro-LED to form a closed perimeter shape, as viewed from the horizontal plane top-down perspective, different than the micro-LED closed perimeter shape.
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