US 12,230,742 B2
Substrate and method of manufacturing thereof
Weiwei Liu, Shenzhen (CN)
Assigned to TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Shenzhen (CN)
Appl. No. 17/252,156
Filed by TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Shenzhen (CN)
PCT Filed Nov. 13, 2020, PCT No. PCT/CN2020/128634
§ 371(c)(1), (2) Date Dec. 14, 2020,
PCT Pub. No. WO2022/052293, PCT Pub. Date Mar. 17, 2022.
Claims priority of application No. 202010945145.4 (CN), filed on Sep. 10, 2020.
Prior Publication US 2022/0320383 A1, Oct. 6, 2022
Int. Cl. H01L 33/54 (2010.01); H01L 33/00 (2010.01); H01L 33/10 (2010.01)
CPC H01L 33/54 (2013.01) [H01L 33/005 (2013.01); H01L 33/10 (2013.01); H01L 2933/005 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a substrate, comprising:
providing a substrate;
forming a light-emitting device binding terminal and a pixel driving circuit configured to drive a light-emitting device to emit light on one side of the substrate, wherein the light-emitting device binding terminal is disposed in a light-emitting device bonding area of the substrate, and the pixel driving circuit is disposed in a driving circuit area of the substrate;
forming a scratch-resistant layer on one side of the light-emitting device binding terminal away from the substrate, wherein the scratch-resistant layer covers the pixel driving circuit, and the scratch-resistant layer is patterned to form a first via hole, and the first via hole exposes the light-emitting device binding terminal;
filling solder paste into the first via hole by screen printing; and
stripping the scratch-resistant layer, wherein the light-emitting device is bound to the light-emitting device binding terminal by solder paste.