CPC H01L 33/06 (2013.01) [H01L 25/0753 (2013.01); H01L 27/15 (2013.01); H01L 27/153 (2013.01); H01L 33/02 (2013.01); H01L 33/04 (2013.01); H01L 33/10 (2013.01); H01L 33/20 (2013.01); H01L 33/24 (2013.01); H01L 33/38 (2013.01); H01L 33/46 (2013.01); H01L 33/50 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/36 (2013.01)] | 20 Claims |
1. A micro-LED chip including multiple micro-LEDs, wherein,
at least one micro-LED of the multiple micro-LEDs comprises:
a first type conductive layer;
a second type conductive layer stacked on the first type conductive layer; and
a light emitting layer formed between the first type conductive layer and the second type conductive layer,
wherein the light emitting layer is continuously formed on the whole micro-LED chip, and the multiple micro-LEDs sharing the light emitting layer,
an isolation structure is formed between adjacent micro-LEDs, at least a portion of the isolation structure being formed in the light emitting layer, and
a bottom surface of the isolation structure is aligned with a bottom of the light emitting layer, and a top surface of the isolation structure is aligned with a top surface of the light emitting layer.
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