US 12,230,709 B2
Transistor structure and manufacturing method of the same
Tung-Yang Lin, New Taipei (TW); and Hsueh-Liang Chou, Hsinchu County (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on Jul. 27, 2022, as Appl. No. 17/815,233.
Application 17/815,233 is a continuation of application No. 15/464,737, filed on Mar. 21, 2017, granted, now 11,456,380.
Prior Publication US 2022/0359750 A1, Nov. 10, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 29/78 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01)
CPC H01L 29/7831 (2013.01) [H01L 29/401 (2013.01); H01L 29/66484 (2013.01); H01L 29/66492 (2013.01); H01L 29/6656 (2013.01); H01L 29/7835 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A transistor structure, comprising:
a substrate;
a first gate extending along a longitudinal direction over the substrate, the first gate comprising a gate electrode, wherein the first gate has a first length along the longitudinal direction;
a second gate over the substrate and apart from the first gate, wherein the second gate has a second length along the longitudinal direction and a second width along a horizontal direction orthogonal to the longitudinal direction, wherein the second length is greater than the second width, and the second length substantially equals the first length;
a source region of a first conductivity type in the substrate, aligning to an edge in proximity to a side of the first gate, having a source length substantially equals the first length;
a P-type well surrounding the source region;
a drain region of the first conductivity type in the substrate, and having a drain length substantially equals the first length;
an N-type well surrounding the drain region, wherein the N-type well has an N-well length along the longitudinal direction, the N-well length is greater than the second length of the second gate, the second gate is entirely within a vertical projection area of the N-type well, and a bottom surface of the P-type well and a bottom surface of the N-type well are substantially at a same depth from the first gate;
wherein the drain length is measured from one edge of the drain region to an opposite edge of the drain region along the longitudinal direction;
the source length is measured from one edge of the source region to an opposite edge of the source region along the longitudinal direction;
the second length is measured from one side of the second gate to an opposite side of the second gate across the longitudinal direction;
the second width is measured from one edge of the second gate to an opposite edge of the second gate across the horizontal direction; and
the N-well length is measured from one side of the N-type well to an opposite side of the N-type well across the longitudinal direction.