CPC H01L 29/7786 (2013.01) [H01L 29/1033 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/66462 (2013.01)] | 20 Claims |
1. An integrated circuit including a back-side field plate to modify an electric field produced by at least one semiconductor device, the integrated circuit comprising:
a substrate including a plurality of conductive layers disposed in a region of the substrate, the plurality of conductive layers comprising at least a portion of the back-side field plate and including a first conductive layer comprising a p-type material, a second conductive layer comprising the p-type material, and an additional layer including an n-type material disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer is located at a first depth in the substrate and the second conductive layer is located at a second depth in the substrate, the second depth being different from the first depth, and wherein the first conductive layer modifies a first range of electric field strengths and the second conductive layer modifies a second range of electric field strengths that is different from the first range of electric field strengths;
a channel layer disposed on a surface of the substrate, the channel layer being comprised of a first compound material having a Group 13 element and Group 15 element; and
a barrier layer disposed on the channel layer, the barrier layer being comprised of a second compound material having a Group 13 element and a Group 15 element.
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