| CPC H01L 29/41733 (2013.01) [H01L 23/5226 (2013.01); H01L 29/45 (2013.01)] | 20 Claims |
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1. An integrated circuit device comprising:
a conductive region on a substrate, the conductive region a first metal;
an insulating film on the conductive region;
a first conductive plug passing through the insulating film and extending in a vertical direction, the first conductive plug including a second metal; and
a conductive barrier pattern between the conductive region and the first conductive plug, the conductive barrier pattern having a first surface in contact with the conductive region and a second surface in contact with the first conductive plug, wherein
a bottom surface and a lower sidewall of the first conductive plug are in contact with the conductive barrier pattern, and an upper sidewall of the first conductive plug is in contact with the insulating film,
the conductive barrier pattern includes a vertical barrier portion between the insulating film and the first conductive plug and a trough portion connected to the vertical barrier portion,
the trough portion has a shape such that the first surface of the trough portion is convex and the second surface of the trough portion is concave, and
the vertical barrier portion has a shape with a width of the shape of the vertical barrier portion in a lateral direction tapering along a first direction away from the conductive region such that the vertical barrier portion tapers to end at a position corresponding to a junction of the lower sidewall and the upper sidewall of the first conductive plug.
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