US 12,230,672 B2
Super junction MOSFET device
Tian Liao, ChongQing (CN); Rongyao Ma, ChongQing (CN); Daili Wang, ChongQing (CN); Pengcheng Zhang, ChongQing (CN); Jing Leng, ChongQing (CN); and Zhongwang Liu, ChongQing (CN)
Assigned to CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO., LTD., ChongQing (CN)
Appl. No. 18/275,614
Filed by CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO., LTD, ChongQing (CN)
PCT Filed Mar. 16, 2022, PCT No. PCT/CN2022/081143
§ 371(c)(1), (2) Date Aug. 3, 2023,
PCT Pub. No. WO2022/257529, PCT Pub. Date Dec. 15, 2022.
Claims priority of application No. 202110631921.8 (CN), filed on Jun. 7, 2021.
Prior Publication US 2024/0038837 A1, Feb. 1, 2024
Int. Cl. H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/78 (2006.01)
CPC H01L 29/0634 (2013.01) [H01L 29/1095 (2013.01); H01L 29/7802 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A super junction MOSFET device, comprising:
a substrate having a first conductive type;
a buffer layer having the first conductive type and disposed on the substrate;
a super junction structure disposed on the buffer layer,
wherein the super junction structure comprises a plurality of first conductive type pillars and a plurality of second conductive type pillars alternately arranged in a transverse direction,
wherein each of the plurality of first conductive type pillars is adjacent to one of the plurality of second conductive type pillars, wherein a second conductive type is different from the first conductive type;
wherein lower portions of a first subset of the plurality of second conductive type pillars are shifted in a first direction for a first width, and lower portions of a second subset of the plurality of second conductive type pillars are shifted in the first direction for a second width; wherein the first width is different from the second width;
a body region having the second conductive type and disposed on a top of one of the plurality of second conductive type pillars;
a source structure located within the body region, wherein the source structure comprises a source region having the first conductive type and an ohmic contact region having the second conductive type, wherein the ohmic contact region is in contact with the source region; and
a gate structure in contact with one of the plurality of first conductive type pillars and the source structure.