US 12,230,662 B2
Backside-illumination solid-state image pickup apparatus, image pickup apparatus, and electronic equipment including embedment members
Naoki Komai, Kanagawa (JP); Hirotaka Yoshioka, Kanagawa (JP); Satoru Wakiyama, Kanagawa (JP); Yuichi Yamamoto, Kanagawa (JP); and Taizo Takachi, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/413,023
Filed by Sony Semiconductor Solutions Corporation, Kanagawa (JP)
PCT Filed Dec. 6, 2019, PCT No. PCT/JP2019/047762
§ 371(c)(1), (2) Date Jun. 11, 2021,
PCT Pub. No. WO2020/129686, PCT Pub. Date Jun. 25, 2020.
Claims priority of application No. 2018-238191 (JP), filed on Dec. 20, 2018.
Prior Publication US 2022/0037382 A1, Feb. 3, 2022
Int. Cl. H01L 27/14 (2006.01); H01L 27/146 (2006.01); H01L 25/065 (2023.01); H01L 25/07 (2006.01); H01L 25/11 (2006.01)
CPC H01L 27/1464 (2013.01) [H01L 27/14621 (2013.01); H01L 27/14636 (2013.01); H01L 27/14689 (2013.01); H01L 25/0652 (2013.01); H01L 25/071 (2013.01); H01L 25/112 (2013.01)] 32 Claims
OG exemplary drawing
 
1. A backside-illumination solid-state image pickup apparatus comprising:
a first semiconductor element having an image pickup element that generates a pixel signal of each pixel;
a second semiconductor element and a third semiconductor element that are smaller than the first semiconductor element, the second semiconductor element and the third semiconductor element having signal processing circuits that are embedded therein by using embedment members and that are necessary for signal processing of the pixel signal; and
a communication wire that electrically connects the second semiconductor element and the third semiconductor element.