US 12,230,661 B2
Electronic device package and fabricating method thereof
Jin Young Kim, Seoul (KR); No Sun Park, Gwangju-si (KR); Yoon Joo Kim, Seoul (KR); Seung Jae Lee, Namyangju-si (KR); Se Woong Cha, Gwangju-si (KR); Sung Kyu Kim, Seoul (KR); and Ju Hoon Yoon, Namyangju-si (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Apr. 12, 2024, as Appl. No. 18/634,665.
Application 18/634,665 is a continuation of application No. 17/837,702, filed on Jun. 10, 2022, granted, now 11,961,867.
Application 17/837,702 is a continuation of application No. 16/907,860, filed on Jun. 22, 2020, granted, now 11,362,128, issued on Jun. 14, 2022.
Application 16/907,860 is a continuation of application No. 16/423,589, filed on May 28, 2019, granted, now 10,692,918, issued on Jun. 23, 2020.
Application 16/423,589 is a continuation of application No. 15/823,987, filed on Nov. 28, 2017, granted, now 10,304,890, issued on May 28, 2019.
Application 15/823,987 is a continuation of application No. 15/248,687, filed on Aug. 26, 2016, granted, now 9,831,282, issued on Nov. 28, 2017.
Application 15/248,687 is a continuation of application No. 14/817,477, filed on Aug. 4, 2015, granted, now 9,431,447, issued on Aug. 30, 2016.
Application 14/817,477 is a continuation of application No. 14/082,482, filed on Nov. 18, 2013, granted, now 9,129,873, issued on Sep. 8, 2015.
Claims priority of application No. 10-2012-0131963 (KR), filed on Nov. 20, 2012.
Prior Publication US 2024/0347575 A1, Oct. 17, 2024
Int. Cl. H01L 27/146 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/528 (2006.01); G06V 40/12 (2022.01); H01L 21/56 (2006.01)
CPC H01L 27/14636 (2013.01) [H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/5286 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 27/14618 (2013.01); H01L 27/14678 (2013.01); G06V 40/12 (2022.01); H01L 21/568 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/211 (2013.01); H01L 2224/214 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18162 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a signal distribution structure comprising a first conductor and a first dielectric material laterally surrounding the first conductor, the first dielectric material forming a first exterior side of the electronic device;
a semiconductor die comprising a first die side, a second die side opposite the first die side, and lateral die sides between the first die side and the second die side, wherein the first die side comprises a sensor and a bond pad;
an encapsulant that laterally covers the lateral die sides, wherein the encapsulant comprises a first encapsulant side, a second encapsulant side, and a lateral encapsulant side between the first encapsulant side and the second encapsulant side;
an interconnect structure passing through the encapsulant, wherein the interconnect structure is electrically coupled to the bond pad and the first conductor;
a protection structure over the first die side and spaced apart from the first die side, wherein the protection structure forms a second exterior side of the electronic device, opposite the first exterior side, with no conductive material exposed at the second exterior side; and
a second dielectric material between the protection structure and the first die side, wherein the sensor is operable to sense an object through the protection structure and the second dielectric material.