| CPC H01L 27/1463 (2013.01) [H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H01L 27/1464 (2013.01); H01L 27/14645 (2013.01); H01L 27/14683 (2013.01)] | 20 Claims |
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1. An image sensor comprising:
a substrate that includes a first surface and a second surface opposite to each other, and includes a first region and a second region disposed around the first region;
a plurality of unit pixels arranged inside the first region of the substrate, each of the plurality of unit pixels including a photoelectric conversion layer;
a pixel separation pattern that extends from the first surface of the substrate to the second surface of the substrate in the first region of the substrate, separates each of the plurality of unit pixels, and includes a pixel separation spacer film and a pixel separation filling film, the pixel separation spacer film defining a pixel separation recess, the pixel separation pattern filling a portion of the pixel separation recess;
a dummy pixel separation pattern that extends from the first surface of the substrate to the second surface of the substrate in the second region of the substrate, and includes a dummy pixel separation spacer film that defines a dummy pixel separation recess, a dummy pixel separation filling film that fills a first portion of the dummy pixel separation recess and a dummy pixel separation capping film that fills a second portion of the dummy pixel separation recess wherein a bottom surface of the dummy pixel separation filling film is spaced apart from the first surface of the substrate in a direction towards the second surface of the substrate and the dummy pixel separation capping film extends between the bottom surface of the dummy pixel separation filling film and the first surface of the substrate;
a wiring structure disposed on the first surface of the substrate and including an inter-wiring insulating film and a first wiring in the inter-wiring insulating film;
a color filter disposed on the second surface of the substrate; and
a first contact that is directly connected to the dummy pixel separation filling film and connects the dummy pixel separation filling film to the first wiring,
wherein a height from the first surface of the substrate to the bottom surface of the pixel separation filling film is greater than a height from the first surface of the substrate to a bottom surface of the dummy pixel separation filling film.
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