| CPC H01L 27/1222 (2013.01) [H01L 27/127 (2013.01); H01L 27/1292 (2013.01)] | 7 Claims |

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1. A method of manufacturing an array substrate, comprising:
providing a base substrate;
forming a first metal layer on the base substrate;
forming a gate insulating layer on the first metal layer;
forming an active layer on the gate insulating layer; and
forming a second metal layer on the active layer,
wherein the active layer comprises a first device layer and a second device layer stacked in sequence, and the second device layer has a two-dimensional nanomaterial and a photosensitivity,
wherein the forming of the active layer on the gate insulating layer comprises:
forming the first device layer on the gate insulating layer, the first device layer having a mobility greater than a preset mobility ranging from 50 to 300 cm2V−1s−1; and
depositing ink on the first device layer by inkjet printing to form the second device layer,
wherein a solute of the ink is Phenylethylammonium Iodide (PEAI): Methyl ammonium iodide (MAI): PbI2=2:2:3.
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