US 12,230,625 B2
Integrated circuit including standard cell and filler cell
Hakchul Jung, Seoul (KR); Ingyum Kim, Bucheon-si (KR); Giyoung Yang, Seoul (KR); and Jaewoo Seo, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Feb. 29, 2024, as Appl. No. 18/591,089.
Application 18/591,089 is a continuation of application No. 17/528,242, filed on Nov. 17, 2021, granted, now 11,948,932.
Claims priority of application No. 10-2021-0039840 (KR), filed on Mar. 26, 2021.
Prior Publication US 2024/0203973 A1, Jun. 20, 2024
Int. Cl. H01L 27/02 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/786 (2006.01)
CPC H01L 27/0207 (2013.01) [H01L 29/0665 (2013.01); H01L 29/42392 (2013.01); H01L 29/78696 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit comprising:
a standard cell comprising a first active region extending in a first direction and having a first width; and
a filler cell comprising a second active region of a same type as that of the first active region and being adjacent to the standard cell in the first direction, the second active region extending in the first direction and having a second width which is greater than the first width,
wherein the standard cell further comprises a first tapering portion of the same type as that of the first active region, the first tapering portion being arranged between the first active region and the second active region and comprising a first contact surface contacting the first active region in the first direction, a second contact surface contacting the second active region in the first direction, and an inclination surface connecting the first contact surface to the second contact surface and having an inclination.