US 12,230,612 B2
Light-emitting diode packaging module having encapsulated array of LED chips
Shuning Xin, Xiamen (CN); Zhen-Duan Lin, Xiamen (CN); Yanqiu Liao, Xiamen (CN); Junpeng Shi, Xiamen (CN); Aihua Cao, Xiamen (CN); Changchin Yu, Xiamen (CN); Chen-Ke Hsu, Xiamen (CN); Chi-Wei Liao, Xiamen (CN); Chia-En Lee, Xiamen (CN); and Zheng Wu, Xiamen (CN)
Assigned to QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD., Nanan (CN)
Filed by QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD., Nanan (CN)
Filed on Mar. 10, 2022, as Appl. No. 17/691,638.
Application 17/691,638 is a continuation in part of application No. PCT/CN2020/098502, filed on Jun. 28, 2020.
Claims priority of application No. 201921554474.5 (CN), filed on Sep. 18, 2019; application No. 201921554475.X (CN), filed on Sep. 18, 2019; and application No. 202020278177.9 (CN), filed on Mar. 9, 2020.
Prior Publication US 2022/0199592 A1, Jun. 23, 2022
Int. Cl. H01L 25/075 (2006.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01)
CPC H01L 25/0753 (2013.01) [H01L 33/54 (2013.01); H01L 33/62 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A light-emitting diode (LED) packaging module, comprising:
a plurality of light-emitting units that are arranged in an array having m row(s) and n column(s), each of said light-emitting units including a first LED chip, a second LED chip and a third LED chip, each of said first, second and third LED chips including a chip first surface as a light-exiting surface, a chip second surface opposite to said chip first surface, a chip side surface that interconnects said chip first surface and said chip second surface, and an electrode assembly disposed on said chip second surface, said electrode assembly including a first electrode and a second electrode;
an encapsulating layer that covers said chip side surface of each of said first, second and third LED chips and that fills in a space among said first, second and third LED chips; and
a wiring assembly that is disposed on said chip second surface of each of said first, second and third LED chips and is electrically connected to said first and second electrodes of said electrode assembly,
wherein m and n each independently represents a positive integer and m×n is not less than 4,
wherein said first, second and third LED chips of each of said light-emitting units are arranged in a first direction,
wherein said first electrode and said second electrode of each of said first, second and third LED chips are aligned in a second direction different from said first direction,
wherein said wiring assembly electrically connects said first electrodes of said first, second and third LED chips of at least two adjacent ones of the light-emitting units in a third direction,
wherein said wiring assembly electrically connects said second electrodes of said first, second and third LED chips of at least two adjacent ones of the light-emitting units in a fourth direction,
wherein said third direction is the same as one of said first direction and said second direction, and
wherein said fourth direction is the same as the other one of said first direction and said second direction, and
wherein each of said light-emitting units has a first light-emitting unit surface having said chip first surface of each of said first, second, and third LED chips, said encapsulating layer being a colored layer, said LED packaging module further including a light-transmitting layer disposed on said first light-emitting unit surface of each of said light-emitting units, said light-transmitting layer having a light transmittance that is greater than that of said encapsulating layer.