US 12,230,606 B2
Semiconductor package and related methods
Seungwon Im, Bucheon (KR); Oseob Jeon, Seoul (KR); JoonSeo Son, Seoul (KR); Mankyo Jong, Bucheon (KR); and Olaf Zschieschang, Vaterstetten (DE)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by FAIRCHILD SEMICONDUCTOR CORPORATION, Phoenix, AZ (US)
Filed on May 10, 2021, as Appl. No. 17/316,367.
Application 17/316,367 is a continuation of application No. 16/521,695, filed on Jul. 25, 2019, granted, now 11,037,907.
Application 16/521,695 is a continuation of application No. 15/623,580, filed on Jun. 15, 2017, granted, now 10,403,601, issued on Sep. 3, 2019.
Claims priority of provisional application 62/351,589, filed on Jun. 17, 2016.
Prior Publication US 2021/0265318 A1, Aug. 26, 2021
Int. Cl. H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/051 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 21/565 (2013.01); H01L 23/3735 (2013.01); H01L 23/5385 (2013.01); H01L 24/00 (2013.01); H01L 25/072 (2013.01); H01L 23/051 (2013.01); H01L 23/3107 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83447 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06589 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a first substrate;
a second substrate;
a first die directly coupled to the first substrate and coupled between the first substrate and the second substrate;
a second die directly coupled to the second substrate and coupled between the first substrate and the second substrate;
an electrical spacer coupled between the first die and the second substrate; and
one or more flexible electrical supports directly coupled to the first substrate and the second substrate;
wherein the electrical spacer is directly coupled to the second substrate.