US 12,230,602 B2
Method for manufacturing electronic chips
Ludovic Fallourd, Louans (FR); and Christophe Serre, Saint Cyr sur Loire (FR)
Assigned to STMICROELECTRONICS (TOURS) SAS, Tours (FR)
Filed by STMICROELECTRONICS (TOURS) SAS, Tours (FR)
Filed on Jul. 8, 2022, as Appl. No. 17/811,560.
Application 17/811,560 is a continuation of application No. 17/111,198, filed on Dec. 3, 2020, granted, now 11,393,786.
Claims priority of application No. 1913750 (FR), filed on Dec. 4, 2019.
Prior Publication US 2022/0344303 A1, Oct. 27, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 21/78 (2006.01)
CPC H01L 24/94 (2013.01) [H01L 21/78 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device, comprising:
a substrate including a first surface, a second surface opposite to the first surface, a first edge, and a second edge opposite to the first edge, and the first and second edges are transverse;
a plurality of contact pads on the first surface of the substrate;
a plurality of connection pillars in contact with the plurality of contact pads and extending away from the substrate, and each pillar of the plurality of pillars has a longer dimension that extends from between the first edge and the second edge;
a first resin on the second surface of the substrate;
a second resin on the first resin and around the plurality of connection pillars, a first one of the plurality of connection pillars including a third surface that is opposite to the first surface of the substrate, and a fourth surface that is between the third surface and the first surface of the substrate; and
a first step that extends from the first edge to the second edge and the first one of the first one of the plurality of connection pillars is aligned with the first step.