CPC H01L 24/75 (2013.01) [H01L 24/81 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H05K 1/18 (2013.01); H01L 2224/75704 (2013.01); H01L 2224/75755 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/81136 (2013.01); H01L 2224/81815 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09163 (2013.01); H05K 2201/10303 (2013.01)] | 10 Claims |
1. A semiconductor device, comprising:
a plurality of semiconductor chips;
a plurality of insulating substrates each mounted with a corresponding one of the semiconductor chips;
a printed circuit board facing the plurality of insulating substrates; and
a conductive member for electrically connecting the plurality of insulating substrates and the printed circuit board, wherein
the printed circuit board has:
a first through part arranged between the plurality of insulating substrates being adjacent to each other in a top view; and
a second through part different from the first through part in shape in a top view;
wherein
the second through part is arranged between the plurality of insulating substrates being adjacent to each other in a top view,
the second through part has a cross-sectional shape having a major axis and a minor axis,
the major axis is larger than a maximum width of a cross-sectional shape of the first through part,
the first through part is arranged on a line extending from the major axis of the second through part, and
the second through part includes a region having, along the major axis of the second through part, a constant width equal to that of the minor axis of the second through part.
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