US 12,230,599 B2
Method for actuating a bonding head
Markus Aebischer, Steinhausen (CH)
Assigned to Besi Switzerland AG, Steinhausen (CH)
Appl. No. 17/252,756
Filed by Besi Switzerland AG, Steinhausen (CH)
PCT Filed Jun. 23, 2019, PCT No. PCT/IB2019/055284
§ 371(c)(1), (2) Date Dec. 16, 2020,
PCT Pub. No. WO2019/244136, PCT Pub. Date Dec. 26, 2019.
Claims priority of application No. 102018115144.6 (DE), filed on Jun. 23, 2018.
Prior Publication US 2021/0272925 A1, Sep. 2, 2021
Int. Cl. H01L 23/00 (2006.01); H01L 21/677 (2006.01)
CPC H01L 24/75 (2013.01) [H01L 21/67721 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75823 (2013.01); H01L 2224/75824 (2013.01); H01L 2224/75843 (2013.01); H01L 2224/75901 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method (200) of adjusting a rotation of a contact surface (185) to at least one rotation angle before mounting components (150) on a substrate (160), provided at a substrate mounting position (165), the method comprising:
providing (210) a bonding head (110) displaceable relative to the substrate (160) along first (170) and second (175) movement axes, the second movement axis (175) being substantially perpendicular to the first movement axis (170);
providing (220) a pick-up member (180) having the contact surface (185), wherein the pick-up member (180) is disposed on the bonding head (110), and wherein the contact surface (185) is configured and arranged to be releasably attachable to components (150), and the contact surface (185) is further configured and arranged to be rotatable about the second movement axis (175):
providing (230) a first engagement member (120), disposed on the bonding head (110), configured and arranged to apply a force along a third movement axis (177) to the bonding head (110) such that the contact surface (185) rotates about the second movement axis (175), the third movement axis (177) being substantially perpendicular to the first movement axis (170) and substantially perpendicular to the second movement axis (175);
providing (240) a first adjustment member (130) in a first adjustment position (132) for rigid engagement with the first engagement member (120);
moving (250) the bonding head (110) to the first adjustment position (132);
rigidly engaging (260) said first engagement member (120) with said first adjustment member (130);
displacing (270) the bonding head (110) along the first movement axis (170), relative to the first adjustment member (130), whereby a force is applied along the third movement axis (177) to rotate the contact surface (185) about the second movement axis (175) to at least one rotation angle;
releasing (280) said first engagement member (120) from said first adjustment member (130); and
displacing (290) the bonding head (110) toward the substrate mounting position (165), the bonding head (110) maintaining (203) the rotation of the contact surface (185) about the second movement axis (175) at the at least one rotation angle.