US 12,230,598 B2
Semiconductor package
You-Wei Lin, Hsinchu (TW)
Assigned to MEDIATEK INC., Hsin-Chu (TW)
Filed by MEDIATEK Inc., Hsin-Chu (TW)
Filed on Feb. 9, 2022, as Appl. No. 17/667,773.
Claims priority of provisional application 63/165,307, filed on Mar. 24, 2021.
Claims priority of provisional application 63/200,210, filed on Feb. 22, 2021.
Prior Publication US 2022/0270997 A1, Aug. 25, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 23/498 (2006.01)
CPC H01L 24/29 (2013.01) [H01L 23/49827 (2013.01); H01L 23/49861 (2013.01); H01L 24/45 (2013.01); H01L 2224/2902 (2013.01); H01L 2224/45099 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a carrier comprising a lead frame, wherein the carrier comprises an outer lead, an inner lead, a grounding ring and a die pad;
a package module disposed on the carrier, comprising:
a first substrate having a first electrical surface facing the carrier and a second electrical surface opposite to the first electrical surface;
a first electronic element disposed on the first electrical surface;
a first conductive wire connecting the electronic element with the first electrical surface of the first substrate;
a grounding conductive wire electrically connected to the grounding ring and the second electrical surface of the first substrate;
a first package body encapsulating the first electrical surface, the first electronic element and the first solder wire; and
a second package body encapsulating the package module and a portion of the carrier.