US 12,230,597 B2
Package structure with warpage-control element
Hao-Jan Pei, Hsinchu (TW); Chih-Chiang Tsao, Taoyuan (TW); Wei-Yu Chen, Taipei (TW); Hsiu-Jen Lin, Zhubei (TW); Ming-Da Cheng, Taoyuan (TW); Ching-Hua Hsieh, Hsinchu (TW); and Chung-Shi Liu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jun. 16, 2023, as Appl. No. 18/336,516.
Application 18/336,516 is a continuation of application No. 17/360,681, filed on Jun. 28, 2021, granted, now 11,721,659.
Application 17/360,681 is a continuation of application No. 16/876,371, filed on May 18, 2020, granted, now 11,049,832, issued on Jun. 29, 2021.
Application 16/876,371 is a continuation of application No. 16/398,119, filed on Apr. 29, 2019, granted, now 10,658,323, issued on May 19, 2020.
Application 16/398,119 is a continuation of application No. 15/499,962, filed on Apr. 28, 2017, granted, now 10,276,536, issued on Apr. 30, 2019.
Prior Publication US 2023/0335525 A1, Oct. 19, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01); H01L 25/11 (2006.01)
CPC H01L 24/19 (2013.01) [H01L 21/565 (2013.01); H01L 21/6835 (2013.01); H01L 23/293 (2013.01); H01L 23/3128 (2013.01); H01L 24/13 (2013.01); H01L 24/25 (2013.01); H01L 24/73 (2013.01); H01L 24/96 (2013.01); H01L 25/105 (2013.01); H01L 25/115 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68368 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/19 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/73209 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/3511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a semiconductor chip;
a protective layer laterally surrounding the semiconductor chip; and
a polymer-containing element over the protective layer, wherein the protective layer is wider than the polymer-containing element, and the polymer-containing element is wider than the semiconductor chip in a lateral direction.