US 12,230,596 B2
Electronics assemblies employing copper in multiple locations
Alfred A. Zinn, Palo Alto, CA (US)
Assigned to Kuprion Inc., Waterbury, CT (US)
Filed by Kuprion Inc., San Jose, CA (US)
Filed on Jun. 22, 2023, as Appl. No. 18/339,865.
Application 18/339,865 is a continuation of application No. 17/266,749, granted, now 11,735,548, previously published as PCT/US2019/045636, filed on Aug. 8, 2019.
Claims priority of provisional application 62/715,916, filed on Aug. 8, 2018.
Prior Publication US 2023/0361071 A1, Nov. 9, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 23/10 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/13 (2013.01) [H01L 23/10 (2013.01); H01L 23/3733 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06541 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic assembly comprising:
an IC substrate;
a package substrate; and
a plurality of interconnects in direct or indirect contact with at least the IC substrate;
wherein each interconnect comprises a bulk copper matrix formed from fusion of copper nanoparticles or a reaction product formed from copper nanoparticles; and
wherein the bulk copper matrix has a nanoporosity of 2-15% and a pore size of about 50 nm to about 500 nm.