US 12,230,594 B2
Printed package and method of making the same
Sreenivasan K. Koduri, Dallas, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Dec. 21, 2021, as Appl. No. 17/557,372.
Claims priority of provisional application 63/132,989, filed on Dec. 31, 2020.
Prior Publication US 2022/0208701 A1, Jun. 30, 2022
Int. Cl. H01L 23/532 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/05 (2013.01) [H01L 23/53204 (2013.01); H01L 24/03 (2013.01); H01L 2224/04042 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/10253 (2013.01)] 51 Claims
OG exemplary drawing
 
1. A method of making a semiconductor apparatus, comprising:
forming a first insulating structure extending from a first bond pad of a semiconductor die to a first conductive lead;
forming a first conductive trace on the first insulating structure from the first bond pad to the first conductive lead;
forming a second insulating structure on the first conductive trace extending from the first bond pad to the first conductive lead; and
forming a third insulating structure, the third insulating structure extending from a second of the bond pads to a second of the conductive leads.