US 12,230,590 B2
Electronic package and manufacturing method thereof
Chih-Hsien Chiu, Taichung (TW); and Ko-Wei Chang, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Jan. 17, 2023, as Appl. No. 18/097,847.
Application 18/097,847 is a continuation of application No. 17/159,527, filed on Jan. 27, 2021, granted, now 11,587,892.
Claims priority of application No. 109132583 (TW), filed on Sep. 21, 2020.
Prior Publication US 2023/0154872 A1, May 18, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/64 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 49/02 (2006.01)
CPC H01L 23/645 (2013.01) [H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 28/10 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19103 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a carrier;
an electronic component disposed on the carrier, wherein the electronic component is a semiconductor chip, and the semiconductor chip includes a semiconductor base and a dielectric body formed on the semiconductor base; and
an inductive structure disposed between the carrier and the electronic component, wherein the inductive structure comprises at least one magnetically permeable member and a conductor structure surrounding the at least one magnetically permeable member, and the at least one magnetically permeable member is provided on a surface of the dielectric body.