US 12,230,586 B2
Printed circuit board and electronic component package including the same
Koo Woong Jeong, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jan. 18, 2022, as Appl. No. 17/577,687.
Claims priority of application No. 10-2021-0132144 (KR), filed on Oct. 6, 2021.
Prior Publication US 2023/0108464 A1, Apr. 6, 2023
Int. Cl. H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
an insulating body having one surface and another surface opposing each other;
first and second wiring layers disposed on the one surface and the another surface of the insulating body, respectively;
a seed layer disposed on the one surface of the insulating body and covering at least a portion of the first wiring layer;
a shielding layer covering a side surface of the insulating body and connected to the first and second wiring layers; and
a first passivation layer disposed on the another surface of the insulating body,
wherein the shielding layer extends to the another surface of the insulating body and is disposed between the insulating body and the first passivation layer.