US 12,230,582 B2
Embedded die on interposer packages
John S. Guzek, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 15, 2023, as Appl. No. 18/368,929.
Application 18/368,929 is a continuation of application No. 17/149,670, filed on Jan. 14, 2021, granted, now 11,798,892.
Application 17/149,670 is a continuation of application No. 16/327,944, granted, now 10,930,596, issued on Feb. 23, 2021, previously published as PCT/US2016/054749, filed on Sep. 30, 2016.
Prior Publication US 2024/0006331 A1, Jan. 4, 2024
Int. Cl. H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01L 25/07 (2006.01)
CPC H01L 23/5389 (2013.01) [H01L 21/56 (2013.01); H01L 21/568 (2013.01); H01L 23/13 (2013.01); H01L 23/48 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 25/065 (2013.01); H01L 25/0657 (2013.01); H01L 25/07 (2013.01); H01L 23/3128 (2013.01); H01L 23/49827 (2013.01); H01L 2224/16 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/18161 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An assembly, comprising:
an interposer having an uppermost surface above a bottommost surface, the bottommost surface of the interposer above and directly connected to circuitry, the circuitry comprising traces, wherein the interposer comprises an epoxy resin;
a first die above and directly connected to the circuitry, the first die laterally adjacent to the interposer, the first die having a top side and a bottom side, the top side opposite the bottom side, the first die having a first lateral sidewall and a second lateral sidewall, and the first die having an uppermost surface at a same level as the uppermost surface of the interposer, wherein the first die is a silicon die;
a mold compound having a first portion and a second portion, the first portion laterally adjacent to the first and second lateral sidewalls of the die and in contact with the interposer, and the second portion beneath the bottom side of the die, wherein the first portion of the mold compound is continuous with the second portion of the mold compound, and wherein the mold compound has a bottommost surface at a same level as the bottommost surface of the interposer; and
a package above the interposer and the first die, the package including a second die;
an underfill material between the package and the first die, the underfill material between the package and the mold compound, the underfill material between the package and the interposer, and the underfill material in contact with the package; and
an interposer via electrically coupling the package to the interposer.